Uncompromised performances for high-speed NDT inspection


Product Line

The MultiX++ full parallel architecture provides uncompromised performance. Ideal to optimize inspection speed, MultiX++ systems are able to drive up to 256 channels in parallel. Usable directly with its dedicated software or remotely through third-party applications. The software handles complex configurations can be setup with the software.

Handled Techniques

Standard phased array

MultiX++ systems can perform electronic and/or sectorial scanning, Full Matrix Capture (FMC), pulse-echo, pitch-catch acquisitions with standard UT, TOFD, linear, matrix, TRL, personalized 2D… phased array probes with up to 256 elements.

Surface Adaptive Ultrasound (SAUL)

Designed for the inspection of complex composite structure, the Surface Adapting Ultrasound (SAUL) technique enables the inspection of components with varying geometries (flat, concave, convex surfaces), using a unique configuration. Used by aircraft manufacturers and their suppliers, SAUL is the perfect tool for the inspection of complex composite components. Learn more


Smart flexible probes, co-designed by CEA and IMASONIC, are phased array probes (linear or matrix) with a conformable front-face and a real-time profilometer. The M2M software plug-in, named SMART, handles those probes. Further, SMART is able to maintain in real-time the characteristics of the ultrasonic beam as the probe moves along complex components.

Fast mode

Natively included in the MultiX++ systems, this inspection mode optimizes parallel firing of multiple apertures (on the same or distinct probes). It is designed to improve the productivity while maintaining the same resolution as the one achieved with an electronic scanning. Moreover, FAST can even achieve higher speeds when firing the entire aperture of the array combined with an electronic scanning in reception . The time necessary for this process is the time of a single shot. Ideal for inspection of thick structures demanding speed. Learn more



Hardware acquisition gates, software gates, synchronization of gates
Acquisition trigger on event (threshold, echo, etc.), acquisition on user-specified trigger (e.g., time, coder)
Choice of data (e.g., RF, peaks, elementary A-scan), real-time imaging, user-specified configuration
Public file format for parameters (XML) and data (binary), max. data flow 30 MB/s


Customized focusing, electronic scanning, sectorial scanning, Full Matrix Capture (FMC)
Pulse-echo and transmit-receive modes, DDF with dynamic aperture
2 GB hardware RAM (enabling fast multiplexing)
Corrected images (e.g., sectorial B-scan, C-scan)


Adjustable voltage: 30 to 200 V with 1 V step
Negative rectangular pulse
Adjustable width: 30 to 625 ns, step of 2.5 ns
Rise time < 10 ns (200 V, 50 Ω)
Max. PRF: 30 kHz


  • 0.8 to 20 MHz
Adjustable gain on each channel from 0 to 80 dB
Cross-talk between two channels > 50 dB
Max. input signal amplitude: 0.8 Vpp
Adjustable analog DAC on 80 dB (max. 40 dB/µs) synchronized on events


Digitizing and real-time summation on 32 channel boards
Max. sampling frequency
  • 100 MHz (adjustable from 100 to 6.6 MHz)
Global delay
  • 0 up to 1.6 ms, step of 10 ns
Delay-laws at transmission/reception
  • 0 to 20 µs, step of 2.5 ns
  • 16 bits
FIR filters
Input impedance
  • 50 Ω
Digitizing depth
  • Up to 50 000 samples (16 000 samples max. per elementary channel)


Parallel summations for fast data acquisition/beam forming
Parallel architecture
  • 32, 64, 128, and 256 channels systems are available
FPGA on CPU-board
Windows-based PC, USB2 link between Hardware and PC (desktop or laptop)


CIVA subset into Multi2000 software, complete description of the inspection configuration
Compatibility with CIVA, NDT kit/ULTIS
Focal-laws and associated ultrasonic field computation


  • 1 × hypertronix connector
64, 128
  • 2 × hypertronix connectors
  • 4 × hypertronix connectors
8 × encoders input, 31 × analog input + 1 × synchro output
2 × switch, 4 × TTL inputs, × 4 TTL outputs
8 × analog outputs, 2 × open collector, 1 × I/O synchro, 1 × USB2
16 × analog inputs, 4 × LEMO® connectors (type 00) (up to 8 optional)


32, 64, 128 (L × W × H)
  • 236 × 376 × 266 mm (9.29 × 14.80 × 10.47 in)
  • ~9.5 kg (20.94 lb)
256 (L × W × H)
  • 342 × 376 × 266 mm (13.46 × 14.80 × 10.47 in)
  • ~13 kg (28.66 lb)